| Products | ICs | Packaging |
Packaging
Packaging |
Technical Information
- Competitor-Package Cross Reference
- Package Outline Drawings with Ordering Codes
- Standard Packing Quantities
- Packing Information
- Interpreting Package Markings
- Interpreting Identification Labels
- Package Moisture Sensitivity Levels (MSL) Data
- Package Thermal Resistance (Rth(j-a) & Rth(j-c)) Data
Family-Specific Information
- IC04 HEF4000B Package Outline Drawings Package Information (Jan 1995)
- IC06 74HC/T High-Speed CMOS Package Information (Aug 25, 2004)
- IC06 74HC/T Package Outline Drawings Package Information (Apr 30, 2003)
Package-Specific Information
- Logic 1G, 2G, and 3G Package Top Markings (Jan 23, 2007)
Literature
 | NXP packages at a glance © December 2007; English; Ordering Code: 9397 750 16182 |
 | Integrated circuit packages Data handbook IC26 2000 © May 2000; English; Ordering Code: 9398 652 90011 |
Articles Featured in the Press
- The Benefits of Standardization in Packaging (in EBN) (Feb 18, 2003)
