Low-profile Fine-pitch Ball Grid Array (LFBGA)

In support of customer demand and the industry's trend toward smaller, more compact designs, NXP, Texas Instruments (TI), and Integrated Device Technology, Inc. (IDT) have agreed to source logic devices with the same functionality and pin-outs in space-saving, low-profile, fine-pitch ball grid array (LFBGA) packaging. This initiative marks the first implementation of BGA packaging in logic devices. Space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules, and handheld computers are ideal applications for logic devices in LFBGA packages.

When compared to existing logic devices in other types of packages, such as TSSOP (thin shrink small outline package), the new LFBGA package will reduce board space by up to 65 percent for the same functionality. Compared with alternative types of packaging, the 0.8-mm ball pitch LFBGA logic package provides improved characteristics in areas such as electrical and thermal performance. The LFBGA package reduces inductance by 45 percent over TSSOP packages. Additionally, the small impedance variations between the package's pins results in a lower skew rate. In tests comparing the thermal performance of this LFBGA package with TSSOP packages, the LFBGA was found to be up to 50 percent more efficient at dissipating heat.

96 Ball		114 Ball
TSSOP/LFBGA Comparison		LFBGA Side View

• Package Outline Drawings
• Standard Packing Quantities

• AN10365 Surface Mount Reflow Soldering Description V4 (Aug 13, 2009)
• ANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) Packages (Oct 26, 1998)