MicroPak^™
XSON (eXtremely thin Small Outline; No leads)

 

NXP advances packaging state-of-the-art with MicroPak (XSON). Designed for use in portable applications, where board space is always an issue, these packages are dramatically smaller, allowing a smaller, slimmer overall design. MicroPak packages are 65% smaller than our smallest PicoGate packages.

The MicroPak package can also be used as an alternative to the Wafer-level Chip Scale Package (WCSP), providing more reliable and more rugged performance in the same amount of space because MicroPak devices have 40% larger pad area than those on a WSCP device.

The NXP MicroPak package evolved from the NXP Micro Carrier Device (MCD), a discrete MOS leadless package built using a quad flat nonleaded technology. MCD is the world's smallest package for single diodes and transistors and improves RF performance by reducing the parasitic capacitances between the die and its package. This technology is now available in popular logic families.

• Incredibly small size enables even smaller system designs
• Lead-free for better environmental specifications
• Leadless design eliminates problems from bent or non-planar leads
• Most devices alternate-sourced for assured supply

MicroPak packages are size and footprint compatible with competing WCSP products such as the TI NanoStar™ yet are superior replacements:

• Since the same die is used for both the PicoGate and the MicroPak (XSON) logic function, the same electrical performance can be expected
• Operating temperature range of -40^oC to +125^oC (NXP exclusive)
• Die encapsulation provides protection from breakage, scratches, humidity, etc.
• Encapsulation provides greater package strength and better mechanical system integrity
• 40% larger solder pads provide greater contact area with circuit board for more reliable connections
• Smaller die size results in superior Moisture Sensitivity Level (MSL)

• Package Outline Drawings
• XSON Package Markings
• Standard Packing Quantities

• SOT886 Packing Tape Dimensions
• 180x62x8 Reel Specifications
• SMD Reel and Packaging Information

• AN10343 MicroPak Soldering Information V2 (Dec 30, 2010)
• Logic 1G, 2G, and 3G Package Top Markings (Jan 23, 2007)
• The Benefits of Standardization in Packaging (in EBN) (Feb 18, 2003)

• AUP Product Family
• HC/T Product Family
• LVC Product Family