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Package outline drawings
In Datasheets
Package outline drawings can be found in most of our product datasheets.
The exceptions are some of our older HC(T) and HEF products.
Their package outline drawings are below:
Stand Alone
Below are stand-alone package outline drawings that are used in
ICs. A listing of all NXP Semiconductors package outline drawings can be found at the bottom of this page.
Note:
All packages are plastic unless otherwise noted.
Listed width and length are nominal package body dimensions.
Listed height is maximum installed package height.
Index
BGA (Ball Grid Array)
- Ordering Code Suffix: BGA = G
| SOT Number | Balls | Attributes |
| 256 | Body 17mm square, height 1.95mm, ball pitch 1mm |
DBS (DIL Bent SIL)
- Ordering Code Suffix: DBS = J
- Ordering Code Suffix: DBS = Q
| SOT Number | Pins | Attributes |
| 9 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 2.54mm |
| 9 | Width 2.5mm, length 13mm, height 14.5mm, mounted height 21.4mm, lead pitch 1.27mm |
| 13 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.7mm |
| 17 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.27mm |
| 23 | Width 4.45mm, length 30.15mm, height 12mm, mounted height 16.9mm, lead pitch 1.27mm |
DIL (Dual In-Line)
Note: These packages are also known as Dual In-line Package (DIP).
- Ordering Code Suffix: DIL = N
- Ordering Code Suffix: DIL = D (All HEF Devices)
- Ordering Code Suffix: DIL = P (All PCF and Some PCA Devices)
- Ordering Code Suffix: DIL = N2 (All SAA Devices)
| SOT Number | Pins | Attributes |
| 8 | 300mil, slim corner leads, width 0.25", length 0.375", height 0.17", lead pitch 0.1" IEC 050G01, JEDEC MO-001, JEITA SC-504-8 compliant |
| 14 | 300mil, width 0.25", length 0.75", height 0.17", lead pitch 0.1" IEC 050G04, JEDEC MO-001, JEITA SC-501-14 compliant |
| 16 | 300mil, long body, width 0.25", length 0.85", height 0.19", lead pitch 0.1" IEC 050G09, JEDEC MO-001, JEITA SC-503-16 compliant |
| 16 | 300mil, short body, slim corner leads, width 0.25", length 0.75", height 0.17", lead pitch 0.1" |
| 20 | 300mil, width 0.245", length 1.0525", height 0.17", lead pitch 0.1" JEDEC MS-001, JEITA SC-603 compliant |
| 24 | 600mil, wide/long body, width 0.55", length 1.25", height 0.2", lead pitch 0.1" IEC 051G02, JEDEC MO-015, JEITA SC-509-24 compliant |
| 24 | 300mil, narrow/long body, width 0.2555", length 1.248", height 0.185", lead pitch 0.1" JEDEC MS-001 compliant |
| 28 | 600mil, short body, width 0.55", length 1.375", height 0.2", lead pitch 0.1" IEC 051G05, JEDEC MS-015, JEITA SC-510-28 compliant |
| 28 | 600mil, long body, width 0.5525", length 1.4375", height 0.2", lead pitch 0.1" IEC 051G06, JEDEC MS-011, JEITA SC-510-28 compliant |
| 40 | 600mil, width 0.55", length 2.0475", height 0.19", lead pitch 0.1" IEC 051G08, JEDEC MO-015, JEITA SC-511-40 compliant |
| 48 | 600mil, width 0.545", length 2.44", height 0.19", lead pitch 0.1" JEDEC MS-011 |
DQFN (Depopulated Quad Flat-pack; No-leads) Variation: DHVQFN (Depopulated Heatsink Very-thin Quad Flat-pack; No-leads) Variation: DHXQFN (Depopulated Heatsink eXtremely-thin Quad Flat-pack; No-leads)
Note: These packages are dual in-line compatible.
- Ordering Code Suffix: DQFN/DHVQFN = BQ (with Side Metal)
- Ordering Code Suffix: DQFN/DHXQFN = BX (Secure Leadless without Side Metal)
| SOT Number | Pads | Attributes |
| 14 | Very thin, with side metal, width 2.5mm, length 3mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 16 | Very thin, with side metal, width 2.5mm, length 3.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 20 | Very thin, with side metal, width 2.5mm, length 4.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 20 | eXtremely thin, without side metal, width 2.5mm, length 4.5mm, height 0.5mm, pad pitch 0.5mm |
| 24 | Very thin, with side metal, width 3.5mm, length 5.5mm, height 1mm, pad pitch 0.5mm |
HBCC (Heatsink Bottom Chip Carrier)
- Ordering Code Suffix: HBCC = W
| SOT Number | Pads | Attributes |
| 24 | Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-217 compliant |
HDIP (Heat-dissipating Dual In-line Package)
- Ordering Code Suffix: HDIP = P
| SOT Number | Pins | Attributes |
| 18 | Width 6.35mm, length 21.55mm, height 4.7mm, lead pitch 2.54mm |
HSOP (Heatsink Small Outline Package)
- Ordering Code Suffix: HSOP = TH
| SOT Number | Pins | Attributes |
| 24 | Low stand-off height, width 11mm, length 15.9mm, height 3.5mm, lead pitch 1mm |
HTSSOP (Heatsink Thin Shrink Small Outline Package)
- Ordering Code Suffix: HTSSOP = TW
| SOT Number | Pins | Attributes |
| 20 | Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 28 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 32 | Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
HUQFN (Heatsink Ultra-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HUQFN = BQ
| SOT Number | Pads | Attributes |
| 60 | Width 5mm, length 5mm, height 0.6mm, pad pitch 0.5mm |
| 60 | Width 4mm, length 6mm, height 0.6mm, pad pitch 0.5mm |
HVQFN (Heatsink Very-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HVQFN = BS
| SOT Number | Pads | Attributes |
| 16 | Body 4mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant |
| 16 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 16 | Clipped corners, punched package, body 3mm square, height 0.9mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 20 | Body 5mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant |
| 20 | Width 5mm, length 6mm, height 1mm, pad pitch 0.8mm JEDEC MO-220 compliant |
| 24 | Body 4mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 24 | Body 3mm square, height 0.85mm, pad pitch 0.4mm |
| 28 | Body 6mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 32 | Body 5mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 32 | Larger heatsink, body 5mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 48 | Body 7mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 48 | Body 6mm square, height 1mm, pad pitch 0.4mm |
| 48 | Larger heatsink, body 6mm square, height 1mm, pad pitch 0.4mm |
| 56 | Body 8mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 64 | Body 9mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
HVSON (Heatsink Very-thin Small Outline; No-leads)
- Ordering Code Suffix: HVSON = TK
| SOT Number | Pads | Attributes |
| 8 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant |
| 8 | Body 4mm square, height 1mm, pad pitch 0.8mm JEDEC MO-229 compliant |
| 10 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant |
HWQFN (Heatsink Very-Very-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HWQFN = HF
| SOT Number | Pads | Attributes |
| 24 | Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 32 | Width 3mm, length 6mm, height 0.8mm, pad pitch 0.4mm |
| 48 | Body 7mm square, height 0.8mm, pad pitch 0.5mm |
| 56 | Width 5mm, length 11mm, height 0.8mm, pad pitch 0.5mm |
HWSON (Heatsink Very-Very-thin Small Outline package; No leads)
- Ordering Code Suffix: HWSON-8 = TP
| SOT Number | Pads | Attributes |
| 8 | Square thermal pad, width 3mm, length 2mm, height 0.8mm, pad pitch 0.5mm JEDEC MO-229 compatible |
| 8 | Clipped-corner thermal pad, width 3mm, length 2mm, height 0.8mm, pad pitch 0.5mm JEDEC MO-229 compatible |
HXQFN (Heatsink eXtremely-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HXQFN = HR
| SOT Number | Pads | Attributes |
| 16 | Body 3mm square, height 0.5mm, pad pitch 0.5mm |
| 16 | Body 2mm square, height 0.5mm, pad pitch 0.4mm |
| 60 | Body 5mm square, height 0.5mm, pad pitch 0.5mm |
| 60 | Width 4mm, length 6mm, height 0.5mm, pad pitch 0.5mm |
HXSON (Heatsink eXtremely Small Outline Package; No leads)
- Ordering Code Suffix: HXSON = GU
- Ordering Code Suffix: HXSON = TL
| SOT Number | Pads | Attributes |
| 8 | Width 1.35mm, length 1.7mm, height 0.5mm, pad pitch 0.4mm |
| 8 | Width 3mm, length 2mm, height 0.5mm, pad pitch 0.5mm JEDEC MO-229 compliant |
LBGA (Low-profile Ball Grid Array)
- Ordering Code Suffix: LBGA = FET
| SOT Number | Balls | Attributes |
| 256 | Body 17mm square, height 1.55mm, ball pitch 1mm |
LFBGA (Low-profile Fine-pitch Ball Grid Array)
- Ordering Code Suffix: LFBGA = EC
- Ordering Code Suffix: LFBGA = F (LH7 and LH7A Devices Only)
| SOT Number | Balls | Attributes |
| 64 | Body 6mm square, height 1.5mm, ball pitch 0.5mm |
| 72 | Body 7mm square, height 1.5mm, ball pitch 0.5mm |
| 81 | Body 9mm square, height 1.6mm, ball pitch 0.8mm JEDEC MO-205 compliant |
| 96 | Width 13.5mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm |
| 114 | Width 16mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm |
| 208 | Body 14mm square, height 1.7mm, ball pitch 0.8mm |
| 256 | Body 14mm square, height 1.7mm, ball pitch 0.8mm |
| 320 | Body 13mm square, height 1.3mm, ball pitch 0.5mm |
| 324 | Body 17mm square, height 1.7mm, ball pitch 0.8mm |
LQFP (Low-profile Quad Flat Pack)
- Ordering Code Suffix: LQFP = BD (All Logic and Microcontroller Devices)
- Ordering Code Suffix: LQFP = B (All 16C Devices)
- Ordering Code Suffix: LQFP = BE (All SC28 Devices)
- Ordering Code Suffix: LQFP = Q (All LH7 and LH7A Devices)
| SOT Number | Pins | Attributes |
| 32 | Body 7mm square, height 1.6mm, lead pitch 0.8mm IEC 136E03, JEDEC MS-026 compliant |
| 44 | Body 10mm square, height 1.6mm, lead pitch 0.8mm IEC 136E08, JEDEC MS-026 compliant |
| 48 | Body 7mm square, height 1.6mm, lead pitch 0.5mm IEC 136E05, JEDEC MS-026 compliant |
| 64 | Body 10mm square, height 1.6mm, lead pitch 0.5mm IEC 136E10, JEDEC MS-026 compliant |
| 64 | Body 7mm square, height 1.6mm, lead pitch 0.4mm IEC 136E06, JEDEC MS-026 compliant |
| 64 | Body 14mm square, height 1.6mm, lead pitch 0.8mm IEC 136E18, JEDEC MS-026, JEITA ED-7311EC compliant |
| 80 | Body 12mm square, height 1.6mm, lead pitch 0.5mm IEC 136E15, JEDEC MS-026 compliant |
| 100 | Body 14mm square, height 1.6mm, lead pitch 0.5mm IEC 136E20, JEDEC MS-026 compliant |
| 144 | Body 20mm square, height 1.6mm, lead pitch 0.5mm IEC 136E23, JEDEC MS-026 compliant |
| 176 | Body 20mm square, height 1.6mm, lead pitch 0.4mm JEDEC MS-026 compliant |
| 208 | Body 28mm square, height 1.6mm, lead pitch 0.5mm IEC 136E30, JEDEC MS-026 compliant |
PicoGate
- Ordering Code Suffix: SC-74/A = GV
- Ordering Code Suffix: SC-88/A = GW
| SOT Number | Pins | Attributes |
| 5 | Smaller, flat body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88A compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible |
| 5 | Smaller, tapered body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-203 compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible |
| 5 | Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74A compliant and SC59, SOT23(-5), SOT59-5, MO-178, TSOP5, SMV compatible |
| 6 | Smaller, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88 compliant and SC70-6 compatible |
| 6 | Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74 compliant |
PLCC (Plastic Leaded Chip Carrier)
- Ordering Code Suffix: PLCC = A
| SOT Number | Pins | Attributes |
| 20 | Body 0.353" square, height 0.18" lead pitch 0.05" IEC 112E04, JEDEC MS-018, JEITA EDR-7319 compliant |
| 28 | Body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MS-018, JEITA EDR-7319 compliant |
| 28 | Pedestal, body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MO-047 compliant |
| 44 | Body 0.653" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant |
| 52 | Body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MS-018, JEITA EDR-7319 compliant |
| 52 | Pedestal, body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MO-047 compliant |
| 68 | Body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant |
| 68 | Pedestal, body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MO-047 compliant |
| 84 | Body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MS-018, JEITA EDR-7319 compliant |
| 84 | Pedestal, body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MO-047 compliant |
QFP (Quad Flat Package)
- Ordering Code Suffix: QFP = BB
| SOT Number | Pins | Attributes |
| 44 | Body 10mm square, height 2.1mm, lead pitch 0.8mm |
| 52 | Higher stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm JEDEC MS-022 compliant |
| 52 | Lower stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm IEC 135E04, JEDEC MS-022 compliant |
| 80 | Higher stand-off; width 14mm, length 20mm, height 3.3mm, lead pitch 0.8mm JEDEC MO-112 compliant |
| 80 | Lower stand-off; width 14mm, length 20mm, height 3.2mm, lead pitch 0.8mm JEDEC MO-112 compliant |
QSOP (Quarter Size Outline Package)
- Ordering Code Suffix: QSOP (16 and 20 pins) = DS
- Ordering Code Suffix: QSOP (24 pin) = DK
| SOT Number | Pins | Attributes |
| 16 | Width 3.9mm, length 4.9mm, height 1.73mm, lead pitch 0.635mm |
| 20 | Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant |
| 24 | Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant |
RBS (Rectangular-Bent Single in-line)
| SOT Number | Pins | Attributes |
| 9 | Width 6.34mm, length 21.6mm, height 3.7mm, lead pitch 2.54mm |
SIL(Single In-Line)
- Ordering Code Suffix: SIL = S
- Ordering Code Suffix: SIL (with fin) = SF
| SOT Number | Pins | Attributes |
| 9 | Width 3.7mm, length 21.6mm, height 6.34mm, mounted height 18.5mm, lead pitch 2.54mm |
| 9 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 14mm, lead pitch 2.54mm |
SO (Small Outline)
- Ordering Code Suffix: SO = D
- Ordering Code Suffix: SO = T (All PCF and Some PCA Devices)
- Ordering Code Suffix: DIL = TN2 (All SAA Devices)
| SOT Number | Pins | Attributes |
| 8 | Small body, width 3.9mm, length 4.9mm, height 1.75mm, lead pitch 0.05" IEC 076E03, JEDEC MS-012 compliant |
| 8 | Large body, width 7.5mm, length 7.55mm, height 2.65mm, lead pitch 0.05" |
| 14 | Width 3.9mm, length 8.65mm, height 1.75mm, lead pitch 0.05" IEC 076E06, JEDEC MS-012 compliant |
| 16 | Narrow body, width 3.9mm, length 9.9mm, height 1.75mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant |
| 16 | Narrow body, low stand-off, width 3.9mm, length 9.9mm, height 1.65mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant |
| 16 | Wide body, width 7.5mm, length 10.3mm, height 2.65mm, lead pitch 0.05" IEC 075E03, JEDEC MS-013 compliant |
| 20 | Width 7.5mm, length 12.8mm, height 2.65mm, lead pitch 0.05" IEC 075E04, JEDEC MS-013 compliant |
| 24 | Width 7.5mm, length 15.4mm, height 2.65mm, lead pitch 0.05" IEC 075E05, JEDEC MS-013 compliant |
| 28 | Width 7.5mm, length 17.9mm, height 2.65mm, lead pitch 0.05" IEC 075E06, JEDEC MS-013 compliant |
| 32 | Width 7.5mm, length 20.5mm, height 2.65mm, lead pitch 0.05" JEDEC MO-119 compliant |
SSOP-II (Shrink Small Outline Package)
- Ordering Code Suffix: SSOP-II = DB
- Ordering Code Suffix: SSOP-II = TS (All PCF Devices)
| SOT Number | Pins | Attributes |
| 14 | Width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 16 | Large body, width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 16 | Small body, width 4.4mm, length 5.2mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant |
| 20 | Small body, width 4.4mm, length 6.5mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant |
| 20 | Large body, width 5.3mm, length 7.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 24 | Width 5.3mm, length 8.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 28 | Width 5.3mm, length 10.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
SSOP-III (Shrink Small Outline Package)
- Ordering Code Suffix: SSOP-III = DL
| SOT Number | Pins | Attributes |
| 48 | Width 7.5mm, length 15.875mm, height 2.8mm JEDEC MO-118 compliant |
| 56 | Width 7.5mm, length 18.425mm, height 2.8mm JEDEC MO-118 compliant |
TFBGA (Thin Fine-pitch Ball Grid Array)
- Ordering Code Suffix: TFBGA = EE (CBT Devices)
- Ordering Code Suffix: TFBGA = ET (16C, LPC1000, LPC2000, and SSTU Devices)
- Ordering Code Suffix: TFBGA = EV (PTN Devices)
| SOT Number | Balls | Attributes |
| 36 | Width 3.5mm, length 3.5mm, height 1.15mm, pad pitch 0.5mm |
| 48 | Width 5mm, length 5mm, height 1.15mm, pad pitch 0.5mm JEDEC MO-195 |
| 48 | Width 4.5mm, length 4.5mm, height 1.10mm, pad pitch 0.5mm |
| 56 | Width 4mm, length 4.5mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195 |
| 64 | Width 6mm, length 6mm, height 1.1mm, pad pitch 0.5mm JEDEC MO-195 |
| 64 | Width 7mm, length 7mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195 |
| 64 | Width 4mm, length 4mm, height 1.1mm, pad pitch 0.4mm |
| 100 | Width 10mm, length 10mm, height 1.2mm, pad pitch 0.8mm |
| 144 | Width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm |
| 160 | Width 9mm, length 13mm, height 1.2mm, pad pitch 0.65mm |
| 176 | Width 6mm, length 15mm, height 1.15mm, pad pitch 0.65mm JEDEC MO-246 |
| 180 | Bevel top, width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm JEDEC MO-216 compliant |
| 180 | Square top, width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm |
| 180 | Square top, marginally-thinner body/marginally-larger solder balls, width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm |
| 180 | Width 10mm, length 10mm, height 1.11mm, pad pitch 0.5mm JEDEC MO-195 compliant |
| 208 | Square body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm |
| 208 | Chamfered body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm |
TQFP (Thin Quad Flat Package)
- Ordering Code Suffix: TQFP = H (LCD Drivers)
- Ordering Code Suffix: TQFP = BC (Microcontrollers)
| SOT Number | Pins | Attributes |
| 44 | Body 10mm square, height 1.2mm, lead pitch 0.8mm IEC 137E08, JEDEC MS-026 compliant |
| 64 | Body 10mm square, height 1.2mm, lead pitch 0.5mm IEC 137E10, JEDEC MS-026 compliant |
TSSOP-I (Thin Shrink Small Outline Package)
- Ordering Code Suffix: TSSOP-I = PW
(All standard logic 14-pin and higher, all CBT, and some GTL/PCA/PCK devices)
- Ordering Code Suffix: TSSOP-I = TT
(All HEF devices)
- Ordering Code Suffix: TSSOP-I = DH
(All PTN and some PCK devices)
- Ordering Code Suffix: TSSOP-I = DP
(All LM, 8-pin LVC and HC/T, and some GTL/PCA/PCK devices)
| SOT Number | Pins | Attributes |
| 8 | Long lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm |
| 8 | Short lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm SM8, SSOP8-P-0.65 compatible |
| 8 | Wide body, long lead, width 4.4mm, length 3mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 10 | Width 3mm, length 3mm, height 1.1mm, lead pitch 0.5mm |
| 14 | Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 16 | Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 20 | Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 24 | Width 4.4mm, length 7.8mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 28 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
TSSOP-II (Thin Shrink Small Outline Package)
- Ordering Code Suffix: TSSOP-II (32 pin) = DR
- Ordering Code Suffix: TSSOP-II (48 to 64 pins) = DGG
| SOT Number | Pins | Attributes |
| 32 | Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 38 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 48 | Width 6.1mm, length 12.5mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 56 | Width 6.1mm, length 14mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 64 | Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
TVSOP (Thin Very Small Outline Package)
- Ordering Code Suffix: TVSOP (48 to 56 pins) = DGV
- Ordering Code Suffix: TVSOP (80 pin) = DGB
| SOT Number | Pins | Attributes |
| 48 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.4mm JEDEC MO-153 compliant |
| 56 | Width 4.4mm, length 11.3mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-194 compliant |
| 80 | Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-153 compliant |
VFBGA (Very thin Fine-pitch Ball Grid Array)
- Ordering Code Suffix: VFBGA = EV
| SOT Number | Balls | Attributes |
| 56 | Width 7mm, length 4.7mm, height 1mm, pad pitch 0.65mm, JEDEC MO-225 compliant |
| 56 | Width 4mm, length 4.5mm, height 1mm, pad pitch 0.5mm |
VSO (Very Small Outline)
- Ordering Code Suffix: VSO = T
| SOT Number | Pins | Attributes |
| 40 | Width 7.55mm, length 15.4mm, height 2.7mm, lead pitch 0.762mm (0.03") |
| 56 | Width 11.05mm, length 21.5mm, height 3.3mm, lead pitch 0.75mm |
VSSOP (Very thin Shrink Small Outline Package)
- Ordering Code Suffix: VSSOP = DC
| SOT Number | Pins | Attributes |
| 8 | Width 2.3mm, length 2mm, height 1mm, lead pitch 0.5mm JEDEC MO-187 compliant and US8 compatible |
XQFN (eXtremely thin Quad Flat package; No leads)
Note: As indicated, some of these packages are also known as MicroPak.
- Ordering Code Suffix: XQFN = GM (0.5mm lead pitch)
- Ordering Code Suffix: XQFN = GU (0.4mm lead pitch)
| SOT Number | Pins | Attributes |
| 8 | (GM) Center thermal pad, body 1.6mm square, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant and MicroPak 8 compatible |
| 8 | (GU8) Width 1.2mm, length 1.4mm, height 0.5mm, lead pitch 0.4mm JEDEC MO-255 compliant |
| 10 | (GM) Width 1.55mm, length 2.0mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant |
| 10 | (GM) Center thermal pad, width 1.55mm, length 2.0mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant |
| 10 | (GU) Width 1.8mm, length 1.4mm, height 0.5mm, lead pitch 0.4mm |
| 12 | (GU) Width 1.7mm, length 2.0mm, height 0.5mm, lead pitch 0.4mm JEDEC MO-288 compliant |
| 16 | (GU) Width 1.8mm, length 2.6mm, height 0.5mm, lead pitch 0.4mm |
XSON (eXtremely thin Small Outline package; No leads)
Note: As indicated, some of these packages are also known as MicroPak.
Note: As indicated, some of these packages are NanoStar compatible.
- Ordering Code Suffix: XSON (0.5mm lead pitch – "standard body" – 6-pin) = GM
- Ordering Code Suffix: XSON (0.5mm lead pitch – "standard body" – 8-pin) = GT
- Ordering Code Suffix: XSON (0.5mm lead pitch – "wide body") = GD
- Ordering Code Suffix: XSON (0.35mm lead pitch – "short body") = GF
- Ordering Code Suffix: XSON (0.35mm lead pitch, 0.35mm height – "short and thin body") = GS
- Ordering Code Suffix: XSON (0.3mm lead pitch, 0.35mm height – "very short and thin body") = GN
| SOT Number | Pins | Attributes |
| 6 | (GM) Standard body, width 1mm, length 1.45mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and MicroPak 6, NanoStar 6 compatible |
| 6 | (GF) Short body, width 1mm, length 1mm, height 0.5mm, lead pitch 0.35mm |
| 6 | (GN) Very short and thin body, width 1mm, length 0.9mm, height 0.35mm, lead pitch 0.3mm |
| 6 | (GS) Short and thin body, width 1mm, length 1mm, height 0.35mm, lead pitch 0.35mm |
| 8 | (GT) Standard body, Width 1mm, length 1.95mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and NanoStar 8 compatible |
| 8 | (GD) Wide body, width 3mm, length 2mm, height 0.5mm, lead pitch 0.5mm VSSOP-8 footprint compatible |
| 8 | (GF) Short body, width 1mm, length 1.35mm, height 0.5mm, lead pitch 0.35mm JEDEC MO-252 compliant |
| 8 | (GN) Very short and thin body, width 1mm, length 1.2mm, height 0.35mm, lead pitch 0.3mm JEDEC MO-252 compliant |
| 8 | (GS) Short and thin body, width 1mm, length 1.35mm, height 0.35mm, lead pitch 0.35mm JEDEC MO-252 compliant |
| 10 | (GF) Short body, width 1mm, length 1.7mm, height 0.5mm, lead pitch 0.35mm |
More Information
Links
MicroPak and NanoStar are trademarks of Fairchild Semiconductor and Texas Instruments, respectively.
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