Thermal resistance R_th(j-a) and R_th(j-c) data

Below is thermal resistance data for package-pin combinations using typical standard logic dies.

Package-Pins	Package Designator	Package Outline Code	Rth(j-a) oC/W	Rth(j-c) oC/W
DQFN-14	BQ	SOT762	61	32
DQFN-16	BQ	SOT763	58	30
DQFN-20	BQ	SOT764	50	23
HVQFN-16	BS	SOT629	40	18
HVQFN-20	BS	SOT662	32	12
HVQFN-24	BS	SOT616	40	18
LFBGA-96	EC	SOT536	60	16
LFBGA-114	EC	SOT537	55	15
PLCC-20	A	SOT380	80	32
PLCC-28	A	SOT261	73	29
PLCC-52	A	SOT238	48	13
SC70/SC88A-5	GW	SOT353	250	69
SC88-6	GW	SOT363	250	69
SC74A	GV	SOT753	250	69
SO-8	D	SOT96	158	43
SO-14	D	SOT108	127	40
SO-16	D	SOT109	115	36
SO-20	D	SOT163	90	27
SO-24	D	SOT137	77	25
SO-28	D	SOT136	69	21
SSOP-14	DB	SOT337	156	40
SSOP-16	DB	SOT338	148	42
SSOP-20	DB	SOT339	136	40
SSOP-24	DB	SOT340	125	37
SSOP-28	DB	SOT341	98	35
SSOP-48	DL	SOT370	88	25
SSOP-56	DL	SOT371	84	24
TSSOP-8	DP	SOT505	120	30
TSSOP-14	PW	SOT402	175	40
TSSOP-16	PW	SOT403	160	39
TSSOP-20	PW	SOT360	146	33
TSSOP-24	PW	SOT355	128	32
TSSOP-28	PW	SOT361	108	29
TSSOP-48	DGG	SOT362	104	23
TSSOP-56	DGG	SOT364	93	21
TSSOP-64	DGG	SOT646	110	26
QFP-52	BB	SOT379	62	15
VFBGA-56	EV	SOT702-1	80	21
VSSOP-8	DC	SOT765-1	206	51

• For Additional R_th(j-a) Info, See Our Packages Data Handbook Chapter 6: Thermal Design Considerations