Very-thin Fine-pitch Ball Grid Array (VFBGA)
In support of customer demand and the industry's trend toward smaller, more compact designs, NXP and Texas Instruments (TI) have agreed to source logic devices with the same functionality and pin-outs in space-saving, very-thin fine-pitch ball grid array (VFBGA) packaging. NXP will initially offer products from the LVC and LVT families in the VFBGA package.
The small size of the VFBGA is ideal for space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules, and handheld computers. When compared to the TSSOP, the new VFBGA package reduces required board space by 70 to 75 percent for the same functionality.
Package Outline Drawings