Very-thin Fine-pitch Ball Grid Array (VFBGA)

In support of customer demand and the industry's trend toward smaller, more compact designs, NXP and Texas Instruments (TI) have agreed to source logic devices with the same functionality and pin-outs in space-saving, very-thin fine-pitch ball grid array (VFBGA) packaging. NXP will initially offer products from the LVC and LVT families in the VFBGA package.

The small size of the VFBGA is ideal for space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules, and handheld computers. When compared to the TSSOP, the new VFBGA package reduces required board space by 70 to 75 percent for the same functionality.

Also, the VFBGA's shorter wire lengths and shorter internal traces improve package performance by up to 30 percent over the larger LFBGA package. The VFBGA package reduces inductance by approximately 50 percent and capacitance by approximately 30 percent over TSSOP packages. Additionally, tests comparing the thermal performance of the VFBGA package with TSSOP packages showed that the VFBGA was up to 50 percent more efficient at heat dissipation.

• VFBGA Package Outline Drawings

• Standard Packing Quantities