Assembly and final-test centers

The assembly and final-test of ICs products takes place at a number of different locations in Asia. All our assembly centers are certified according to ISO9000/QS9000 quality requirements and to ISO14001 environmental requirements.

The following table gives an overview of the assembly and final-test centers for the different packages and includes the code used for each center.

Code	Facility	Location	Packages
0	APM	Seremban, Malaysia	PicoGate
n	APB	Bangkok, Thailand	DIL, DQFN, HVQFN, SO, SSOP, TSSOP
p	HANA	Ayudthaya, Thailand	VSSOP
u	ATP	Manila, Philippines	DQFN, HVQFN, LQFP, SSOP, TSSOP, LFBGA, VFBGA
P	APHK	Hong Kong	XSON
R	UTAC	Bangkok, Thailand	SO, TSSOP
S	APK	Kaohsiung, Taiwan	QFP, LQFP, DHVQFN
X	ASEN	Suzhou, China	SO, SSOP, TSSOP, LQFP, HVQFN

The codes for the assembly and final-test centers above are used in the second and third letters, respectively, of the 3rd line of package markings.

The codes are also found on the product identification labels as the second and third letters of the Product Manufacturing Codes (PMC) line.

A reference from logic packages to assembly and final-test centers can also be downloaded:

• Logic Assembly Roadmap January 2007

• ICs Diffusion Centers
• Package Markings
• Product Identification Labels
• ICs Package Outline Drawings