Family and package overview

Much of our product quality and reliability information is based on manufacturing processes and packaging. The tables below give you an overview of how and where our product families are produced as well as where our different packages are assembled and tested.

You can determine the actual diffusion, assembly, and final-test center of a given device by examining its package markings or its product ID label.

Family	Process	Diffusion Center(s)
7SET	CMOS	U
7SH	CMOS	U
7WH	CMOS	U
ABT	BiCMOS	U, Y
AHC(T)	CMOS	U
ALVC	CMOS	T
ALVT	BiCMOS	U, Y
AUP	CMOS	T
CBT	CMOS	T, Y
CBTV	CMOS	Z
FAST	Bipolar	Y
GTL	Bipolar	Y
HC(T)	CMOS	U
HEF4000	CMOS	U
LV	CMOS	U
LVC	CMOS	s, U
LVT	BiCMOS	U, Y
MB	BiCMOS	U, Y
PCA	BiCMOS	k, T, Y
PCK	BiCMOS	k, T
PTN	BiCMOS	T
VHC(T)	CMOS	U

Package	Assembly/Test Center(s)
PicoGate	0, P
XSON	P
DIL	+, n
SO	n, A, R, X
SSOP	n, u, X
TSSOP	n, u, R, X
VSSOP	p
PLCC	h, S
LFBGA	u
VFBGA	u
QFP	v, S
LQFP	u, S, X
DQFN	n, u
HVQFN	n, u, X

• ICs Diffusion Centers
• ICs Assembly and Final-Test Centers

• Package Markings Page
• Product Identification Label Page